suria3
Full Member level 5
Hi Guys,
I have question here. I have designed a transimpedance amplifier (TIA) which works at 1.25Gbps. I have run the AC simulation at the package level (wire-bonding model). Attached are the 2 plots of the gain fucntion. Bode1 is the gain function with the multiple ground pin and Bode2 is the gain function with single ground pin. If we look at the graphs, it shows that multiple pad of grounds causing no peaking the at -3dB bandwidth, i believe this is due to the LC inductance peaking issue. A few packages in parallel reduced the effective inductance compared to a single package which cause the peaking in Bode2. Can anybody give me the better explanation on this issue. Is in the manufacturing, having multiple ground pads (package) is recommended?
Thanks,
suria3
I have question here. I have designed a transimpedance amplifier (TIA) which works at 1.25Gbps. I have run the AC simulation at the package level (wire-bonding model). Attached are the 2 plots of the gain fucntion. Bode1 is the gain function with the multiple ground pin and Bode2 is the gain function with single ground pin. If we look at the graphs, it shows that multiple pad of grounds causing no peaking the at -3dB bandwidth, i believe this is due to the LC inductance peaking issue. A few packages in parallel reduced the effective inductance compared to a single package which cause the peaking in Bode2. Can anybody give me the better explanation on this issue. Is in the manufacturing, having multiple ground pads (package) is recommended?
Thanks,
suria3