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its very simple, select any layer which is free draw the shape of via, like rectangle to make box kind of via, circle to make cylinder kind of via, stright line to make planar via, (it is automatically extruded in to 3D by software), now go to subsrate create/modify, click layout layers tab, click the substrate layer in via you want to punch via, then on right you will find the drop down menu select the layer on which you made the shape of via, and click the button "via" which appear above apply button, thats it
Hello guys. I need some help with the via configuration dialog box in ADS.
First of all, check my layer stackup out:-
FreeSpace (open boundary)
RO4350b
PrePreg
FR4
Air (open boundary)
And here is some detail of the metallization:-
FreeSpace
-------- -STRIP-RouteLayer1
RO4350b |VIA| diel2
-------- -SLOT-cond2
PrePreg |VIA| diel
-------- -SLOT-cond3
FR4 |VIA| diel3
-------- -STRIP-RouteLayer2
Air
Please see if I'm going at it the right way. The board is a 4 layer board with RouteLayer1 and RouteLayer2 as RF and control signal routing layers respectively. Whereas, cond2 and cond3 are GND and Power planes.
Now, I want to be able to connect vias from RouteLayer1 and RouteLayer2 to all metallization layers. I'm getting stuck at the Via Configuration dialog box (Options>Via Configuration...).
I cant seem to be able to add any via to the list. Please help me out here.
Also, as a corollary, I need a solution to connect a STRIP and a SLOT layer.
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