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Wafers are the part that is divided into dies at which circuits integration is done.And at following manufacturing steps these dies are inserted into the packages.
Because they have found it the most useful to manufacture discrete or integrated electronic devices on the form of wafer, using batch fabrication processing.
integrated electronic devices on the form of wafer, using batch fabrication processing. , wafer is made of semiconductor, an abundant material coming from the earth.
Because they have found it the most useful to manufacture discrete or integrated electronic devices on the form of wafer, using batch fabrication processing.
To answer this question,we can think from technical and economic site.
1) Planar processing technique.
2) Bandgap (1.12eV) is suitable for every devices design,even the rectifier.
3) like other say: there are a lot of sand in this world
hi.
the Wafer structures has been used to atcheive to compactness circuits and devices, usually.
for more information you have refer to design of integrated circut design books.
best regards for you
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