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Difference between Pins, Pads, Bond Pads in layout

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Hi All,

I want to know whats the difference between a Pin, Pad and Bondpad in layouts in general, It would be really helpful if there are any screen shots to supplement.
 

Hi,

Pads means means interface logic between chip and external environment,,it involves ESD ckt,
Buffer circuits other protection ckts.

Bond pads means the place in Pads which we can take wires from die to packaging..

Pins menas lead material which are coming out of packages.
 
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