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the PCB laminate parameters?

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taymoor2000

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Dear All;

please, can any one till me the meaning of TGA degradation temperature?
and if there any document explane the PCB laminate parameters(Er , DF ,Tg , TGA ,TMA ,..)

Thanks
 

Thermogravimetric analysis (TGA) is an analytical technique used to determine a material’s thermal stability and its fraction of volatile components by monitoring the weight change that occurs as a specimen is heated.

Er is the dielectric constant (permitivity), Tg is the glass transition temperature, and TMA is thermomechanical analysis.

A good book on printed circuits may have most of the defintions for you. "Printed Circuits Handbook" by Coombs has been around for many years and may answer most of your questions. Try doing a search on this forum for Coombs.
 
dunno if this helps..the file name is self explainatory is guess..
 

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