Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

What exactly is a bond pad?

Status
Not open for further replies.

daniel_paulino

Newbie level 2
Newbie level 2
Joined
Nov 26, 2006
Messages
2
Helped
0
Reputation
0
Reaction score
0
Trophy points
1,281
Activity points
1,294
im fresh in this area, i woud like to know what is bond pad

thank you for your attention
 

Re: bond pad

Hmmm...

Have you ever seen an IC?

What you might have seen is actually the IC Package. The IC itself (the silicon) is usually much smaller in size and is present inside the IC Package. The purpose of this ceramic package is

1. to provide mechanical support to the IC
2. provide PINS that go into sockets...

The pins on the IC package and connected to the die(fabricated silicon, the actual IC) using BONDING WIRES.....the metallization(connection) on the die that these BONDING WIRES are connected to, is called PAD or a BONDING PAD.

HOPE THIS HELPS!
 
Status
Not open for further replies.

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top