020170
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packaging vendors ipac
When I designed Full custom circuit, I have to consider inductance in boning wire.
Becuase it affect some clock signal or mixed signal especailly at high frequency.
some poor Fabrication do not offer package modeling files. It is terrible for circuit designer.
that is true, nevertherless, I believe that some generalized package model exists in each minimum L , like 0.35 , 0. 18 .. etc
how about your opinion? and How do I determine package model for accurate simulation result?
Does MOSIS offers package modeling file? or Where do I get that?
thanks
When I designed Full custom circuit, I have to consider inductance in boning wire.
Becuase it affect some clock signal or mixed signal especailly at high frequency.
some poor Fabrication do not offer package modeling files. It is terrible for circuit designer.
that is true, nevertherless, I believe that some generalized package model exists in each minimum L , like 0.35 , 0. 18 .. etc
how about your opinion? and How do I determine package model for accurate simulation result?
Does MOSIS offers package modeling file? or Where do I get that?
thanks
