tiger_ads
Member level 3
when using asitic modeling inductor, it require a technology file like this:
<chip>
chipx = 512 ; dimensions of the chip in x direction in microns
chipy = 512 ; dimensions of the chip in y direction
fftx = 256 ; x-fft size (must be a power of 2)
ffty = 256 ; y-fft size
TechFile = sample.tek ; the name of this file
TechPath = /home/niknejad/tekf ; the pathname of the data files
freq = .1
eddy = 0 ; Layer 0 defined below is conductive
eddy = 1 ; Layer 1 defined below is also conductive
; Layer 2 is not conductive (oxide)
<layer> 0 ; Bulk Substrate
rho = .1 ; Resistivity: ohm-cm
t = 400 ; Thickness: microns
eps = 11.9 ; Permitivity: relative
<layer> 1 ; Epi Layer
rho = 15 ; ohm-cm
t = 1 ; microns
eps = 11.9 ; relative
<layer> 2 ; Oxide Layer
rho = 1e10 ; ohm-cm
t = 50 ; microns
eps = 4 ; relative
<metal> 0 ; Substrate Contact Layer
layer = 1 ; Epi Layer
rsh = 30 ; Sheet Resistance Milli-Ohms/Square
t = 0.1 ; Metal Thickness (microns)
d = .5 ; Distance from bottom of layer (microns)
name = msub ; name used in ASITIC
color = yellow ; color in ASITIC
<via> 0 ; metal 1 to substrate
top = 1 ; via connects up to this metal layer
bottom = 0 ; via connects down to this metal layer
r = 5 ; resistance per via
width = .4 ; width of via
space = 1.3 ; minimum spacing between vias
overplot1 = .3 ; minimum dist to substrate metal
overplot2 = .3 ; minimum dist to metal 1
name = via0 ; name in ASITIC
color = purple ; color in ASITIC
<metal> 1 ; metal layer 1
layer = 2
rsh = 50
t = 1
d = 1.62
name = m1
color = red
<via> 1 ; metal 1 to metal 2
top = 2
bottom = 1
r = 4
width = .5
space = 1.5
overplot1 = .4 ; to substrate metal
overplot2 = .4 ; to metal 1
name = via1
color = white
<metal> 2 ; metal 2
layer = 2
rsh = 32
t = 1.3
d = 2.74
name = m2
color = blue
where can i find these parameters in charter's process kit???????
<chip>
chipx = 512 ; dimensions of the chip in x direction in microns
chipy = 512 ; dimensions of the chip in y direction
fftx = 256 ; x-fft size (must be a power of 2)
ffty = 256 ; y-fft size
TechFile = sample.tek ; the name of this file
TechPath = /home/niknejad/tekf ; the pathname of the data files
freq = .1
eddy = 0 ; Layer 0 defined below is conductive
eddy = 1 ; Layer 1 defined below is also conductive
; Layer 2 is not conductive (oxide)
<layer> 0 ; Bulk Substrate
rho = .1 ; Resistivity: ohm-cm
t = 400 ; Thickness: microns
eps = 11.9 ; Permitivity: relative
<layer> 1 ; Epi Layer
rho = 15 ; ohm-cm
t = 1 ; microns
eps = 11.9 ; relative
<layer> 2 ; Oxide Layer
rho = 1e10 ; ohm-cm
t = 50 ; microns
eps = 4 ; relative
<metal> 0 ; Substrate Contact Layer
layer = 1 ; Epi Layer
rsh = 30 ; Sheet Resistance Milli-Ohms/Square
t = 0.1 ; Metal Thickness (microns)
d = .5 ; Distance from bottom of layer (microns)
name = msub ; name used in ASITIC
color = yellow ; color in ASITIC
<via> 0 ; metal 1 to substrate
top = 1 ; via connects up to this metal layer
bottom = 0 ; via connects down to this metal layer
r = 5 ; resistance per via
width = .4 ; width of via
space = 1.3 ; minimum spacing between vias
overplot1 = .3 ; minimum dist to substrate metal
overplot2 = .3 ; minimum dist to metal 1
name = via0 ; name in ASITIC
color = purple ; color in ASITIC
<metal> 1 ; metal layer 1
layer = 2
rsh = 50
t = 1
d = 1.62
name = m1
color = red
<via> 1 ; metal 1 to metal 2
top = 2
bottom = 1
r = 4
width = .5
space = 1.5
overplot1 = .4 ; to substrate metal
overplot2 = .4 ; to metal 1
name = via1
color = white
<metal> 2 ; metal 2
layer = 2
rsh = 32
t = 1.3
d = 2.74
name = m2
color = blue
where can i find these parameters in charter's process kit???????