bejing
Member level 2
hi
when we design a rf layout for example in ADS, and then send it to a PCB Manufacturer,
they print the layout on a laminate.
in the photo-etching process, several undesirable effect will occur on pcb trace width.
can anyone explain what type of effects can occur. and how we can compensate for that errors (pcb fabrication errors)?
is offseting the boundry of trace, an issue?
thanks.
when we design a rf layout for example in ADS, and then send it to a PCB Manufacturer,
they print the layout on a laminate.
in the photo-etching process, several undesirable effect will occur on pcb trace width.
can anyone explain what type of effects can occur. and how we can compensate for that errors (pcb fabrication errors)?
is offseting the boundry of trace, an issue?
thanks.