Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

Mimimum and Maximum density rule check ..!

Status
Not open for further replies.

starinspace

Junior Member level 2
Junior Member level 2
Joined
Apr 1, 2013
Messages
23
Helped
3
Reputation
6
Reaction score
3
Trophy points
1,283
Location
Hubli, India
Activity points
1,442
Hi All,

I have couple of questions and need clarifications :

1. Why do we do minimum and maximum metal density check ? :-(

My understanding is that minimum density check should be done to avoid any sweep away of small metals in less denser areas during etching process. Maximum density check should be done to avoid the dishing ( i.e the plane surface dipping down due to heavy weight of the metal above it because oxide is porous). Am I right in both the cases ?

2. Why should we check the density rules for base layers? (like active area) :shock:

Please reply..
 

Yes, on point 1. On a basic level the density checks are to ensure an even spread of metal and to ensure all required metal is formed correctly.

On point 2, the need is also present for the base layers because these also have effect on device performance. Some effects can be
- Well proximity (distance to NWELL regions)
- Length of active diffusion (threshold voltage can be effected by length of active layer or diffusion layer)
- Active space effect, STI effect. This is a mechanical stress caused by differences in active layer space

So, there are density rules for these layers to ensure an even distribution of the layers so the spacing in your layout will correspond correctly to the actual spacing in the final silicon.
 
Hi DharmaSlice,

After reading your post I now quite have a better idea on how the STI might affect. Can you please explain a little more on how the WPE and LOD are affected by the dummy filling of base layers?

And also which all base layers are checked for their density ? I have not come across nwell dummy till now in my work...
 

Hi DharmaSlice,

After reading your post I now quite have a better idea on how the STI might affect. Can you please explain a little more on how the WPE and LOD are affected by the dummy filling of base layers?

And also which all base layers are checked for their density ? I have not come across nwell dummy till now in my work...

The only base layer dummy are diffusion and poly.

I was just pointing out effects with layers other than metal in my last comment. Didn't mean to imply the NWELL was also a dummy layer required.
 
Last edited:

The only base layer dummy are diffusion and poly.

I was just pointing out effects with layers other than metal in my last comment. Didn't mean to imply the NWELL was also a dummy layer required.

Thank-you very much for your clarifications..:)
 

Status
Not open for further replies.

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top