Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

Register Log in

How to create a Bond pad?

Status
Not open for further replies.
M

mikcup

Newbie level 2
Newbie level 2
Joined
May 14, 2013
Messages
2
Helped
0
Reputation
0
Reaction score
0
Trophy points
1,281
Activity points
1,293
Hi all,

I'm assigned to layout for a Bond pad but i'm not clear.
I would like to know which layers are used in a Bond pad, the way to create, and are there any documents about it?

Thanks much.
 

top and bottom layer is ok. but in the area of bond have to layout with top/bottom solder.
the pad as usual without any defferent.
 
  • Like
Reactions: mikcup

    M

    mikcup

    Points: 2
    Helpful Answer Positive Rating
    V

    Points: 2
    Helpful Answer Positive Rating
Thanks Armoric.

Do you have any piture or document? it'll help me much.
 

Why IOs are operated at higher voltages and Cores are operated at lower voltages?
 

why do you mean by bound pad, the metal area where the bound wire will be connected?
there is two type of bound pad, with CUP or not, here CUP mean circuit under pad, which means some top METAL layers are used for the bound area, and the lower layer are used to implement the pad functionality.
 

Status
Not open for further replies.

Similar threads

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top