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Is it possible to find somewhere the exact procedure how to achieve this scheme? Or could you please briefly describe the steps how to do it? Thank you for your reply.
Thank you for answers.
So question is - what should be the right step between lumped and distributed form, since it can't be done directly as you wrote?
you can find some informations in above post #9 (calculation to microstrip form -> substrate - Er=2.33 and h=1.27 mm, Zhigh=155.9, Zlow=40.73, cutoff freq=694MHz)
How can I compensate T-junction discontinuity? I need advice on how to do it easily and especially correctly. Because my designed filter not working properly due to T-junction discontinuity.
Thanks for any advice
Hello everyone, you help me a lot before and I have request for a help again.
I successfully repeated example in chapter 5.1.3 from this book: HONG, Jia-Shen G.; LANCASTER, Michael J. Microstrip filters for RF/microwave applications. You can see that example above in post #9. So I use this...
how to solve it?
maybe larger substrate is needed to avoid short circuit?
EDIT: open stub shorted to the simulation boundary was the problem as you mention, so then i made substrate larger(to create gap above stub) and it works!
thank you so much for advice
i try to make project in CST from given example, but my simulated S-parameters dont equal expected S-parameters and everything looks right(scheme, lengths/widths of microstrip), so what could be wrong(i think potential problem could be somewhere in CST)?
Is this only way how to do it? I mean, i knew values of L=20nH, Cp=1.9pF, Cs=1.2pF, Z=75 ohm - from that can be calculated impedance and not from table as was shown in the video.
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