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eaasy way:
save OA design and use icfb with OA support
if you want uses gds, map file is very important, try let encounter create streamOut.map at 1st time, then modify by your hand, you must know which layer of encounter will translate into the layer of gds.
you can to read the tech section...
for .5 process, 3M better.
because 1st metal always used by cell layout, most of these areas are not available for routing, but for success routing, you need at lease 2 layers, M2 for horizontal routing and M3 for vertical.
so the 3M is the better choice for APR, 2M better for hand craft layout.
no, they are different, for a .5um preocess example:
MACRO ND02D1
SIZE 5.40 BY 16.20 ;
...
MACRO ND02D2
SIZE 10.80 BY 16.20 ;
...
because more drive strength need more W/L ratio of MOSFETs, when W increases. cell area will increases.
ACS needs lots of cpus, otherwise it's no value, because it's "distrubuted synthesis", the acs engine partition big design into small pieces, and synthesis them concurrently in many cpus, that's why it can handle large designs and improve runtime.
Re: Are you satisfied with design service/ASIC house's die s
in the case of low metal layer used(2-4 Layer), and the scale is large(gatecount > 300K), the chip utilization will be as low as 50 %, otherwise the routebility will not be reached.
another issue is pad limit, if you have too much...
it's true, the same case as synplify vs fpga compiler, but, the dc is the industrial standard now, it's the only problem to replace it with other asic synthesis tools.
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