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Power and Thermal Management in Emulation

Screen Shot 2024-07-19 at 15.41.41.png
Screen Shot 2024-07-19 at 15.41.41.png

In the realm of integrated circuit (IC) design, effective power and thermal management is paramount. Emulation provides a powerful platform for identifying and addressing power and thermal issues early in the design process, ensuring reliability and efficiency in final hardware. This blog delves into advanced techniques for power and thermal management in emulation, emphasizing technical depth and specific case studies.

Importance of Power and Thermal Management in Emulation​

Power and thermal management during emulation ensures that designs operate within acceptable limits, preventing overheating, ensuring energy efficiency, and maintaining overall system reliability. Emulation helps in identifying power and thermal hotspots, allowing for early intervention and optimization.

Advanced Power Management Techniques​

1. Dynamic Power Analysis
Dynamic power analysis involves monitoring power consumption in real-time during emulation, providing insights into how different parts of the design contribute to overall power usage.

Case Study:
A leading semiconductor company employed Siemens' PowerPro during emulation to achieve significant RTL power savings. Integrating power analysis with emulation, they managed to reduce sequential logic power consumption by up to 37%, ensuring the design met stringent power requirements.
Implementation:
  • Power Monitoring Tools: Utilize tools such as PowerPro or Synopsys SpyGlass Power to dynamically monitor power usage during emulation.
  • Power Optimization: Apply power-saving techniques like clock gating and power gating to reduce overall consumption.
2. Peak Power and Thermal Hotspot Analysis
Analyzing peak power consumption and identifying thermal hotspots during emulation helps in understanding worst-case scenarios and ensuring the design can handle peak loads without overheating.

Case Study:
An automotive electronics company used Mentor Veloce’s Power App for peak power and thermal hotspot analysis during emulation. This approach allowed them to identify critical areas in their design that required thermal management solutions, thus preventing potential thermal failures in their ADAS systems.
Implementation:
  • Thermal Analysis Tools: Use tools integrated with emulation platforms, such as Veloce Power App, for detailed thermal analysis.
  • Thermal Mitigation Strategies: Implement heat sinks, thermal vias, and optimized placement of high-power components to manage thermal hotspots effectively.

Advanced Thermal Management Techniques​

1. Thermal Simulation and Emulation Integration
Integrating thermal simulation with emulation allows for a comprehensive analysis of thermal behavior under different operating conditions, validating thermal designs to ensure they meet operational requirements.

Case Study:
A data center processor manufacturer integrated thermal simulation with their emulation workflow to validate the thermal performance of their multi-core processors. By simulating real-world operating conditions, they ensured their processors could operate reliably under high computational loads.
Implementation:
  • Thermal Simulation Tools: Utilize tools like Cadence Joules and Ansys RedHawk to simulate thermal performance during emulation.
  • Validation under Load: Test the design under various load conditions to ensure it can handle thermal stresses effectively.
2. Real-Time Thermal Monitoring
Real-time thermal monitoring during emulation helps in dynamically adjusting cooling solutions and optimizing thermal management strategies.

Case Study:
A telecom equipment manufacturer employed real-time thermal monitoring during emulation to manage the thermal performance of their 5G baseband processors. This real-time approach allowed them to adjust their cooling strategies dynamically, ensuring reliable operation even under peak load conditions.
Implementation:
  • Thermal Sensors: Integrate thermal sensors within the emulation setup to monitor temperature in real-time.
  • Dynamic Cooling Solutions: Implement dynamic cooling solutions such as variable-speed fans and liquid cooling systems to actively manage thermal performance.
About author
Peng Yu
With a wealth of experience in formal verification projects, I specialize in two critical solutions: formal signoff with full proof and formal signoff with coverage. Throughout my career, I have successfully tackled a diverse range of designs, including Instruction units, Standard interfaces, User-defined interfaces, Bus matrices, Caches, MMUs, Schedulers, DMA controllers, Memory controllers, Interrupt controllers, Power management units, and various specific functional modules.

Drawing on this extensive project experience and a deep understanding of various design types, I have developed a unique formal verification methodology. This methodology has been honed through practical application and has proven highly effective in ensuring design correctness and efficiency.

One of my key achievements has been the independent creation of a comprehensive formal verification IP library. This library comprises nearly 200 units, encompassing basic, common, VIP, and flow libraries. These resources, combined with my methodology, have been successfully deployed in the product development workflows of numerous leading chip companies. The results speak for themselves, with significant improvements in verification effectiveness and performance observed across the board.

My goal is to share this expertise with students at EDA Academy, providing them with practical insights and industry best practices that they can apply directly to their own projects. By imparting this knowledge, I aim to empower learners to achieve their verification goals with confidence and efficiency.

EDA Academy:https://www.eda-academy.com
Explore our current Formal Verification courses:
  1. Introduction to Formal Verification
  2. Formal Verification: SVA Coding
  3. Formal Verification: PSL Coding

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Peng Yu
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