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Tremendous generation of e-waste and its illegal recycling are causing immense threat to environment as well as the loss of precious metals.
The present research reports a novel hybrid process for the total recovery of gold from small depopulated components of e-waste.
Connectors and...
When people think of printed circuit boards, they often think of rigid boards with components mounted to them. But the term ‘PCB’ can actually refer to both rigid and flexible PCBs.
Flexible PCBs — or ‘flex circuits — are characterized by a malleable base material and derive their name from...
A research report on the Electronic Printed Circuit Board (PCB) market by Market Research Store
provides the vital information associated with the market growth during the forecast time frame.
The document also covers information such as historical, current, and future growth rate and finances...
PCB design has always been where the rubber meets the road in terms of applied engineering to make a physical product.
Driven by all the disciplines required to build a modern PCB, design teams need better tools to streamline ever-shortening design cycles.
Time is of the essence, and more data...
Major chipset companies including Samsung, MediaTek, Broadcom and Intel teamed up to develop a framework for open RF interfaces, though important cooperator Qualcomm was absent from the effort.
Working together as the Open RF As, the companies aim to create conditions for standardized core...
With the increased use of electronics in new technology areas flux formulations are being developed to address the new and existing requirements
For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for...
As electronic passive components continue to shrink in size, methods for their rework need to be developed by electronic manufacturers to maintain and support PCB assembly processes.
Here, compare and outline of a few of these rework methods. 0201 package type is one of conventional methods...
Hundreds of parameters can be measured in race cars competition. During the race, a lot of data are sent from the cars to the teams every second, transmitting various types of information about everything from tire wear to engine temperature.
SECU is the main data storage and acquisition service...
When potential process defects begin showing up underneath BGAs in electronic assemblies, there are numerous failure analysis tests that can be used to troubleshoot process problems.
In determining potential assembly defects at BGA locations. The first level of BGA failure analysis is visual...
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